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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/21 datashee t www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 tsz02201-0323aaj00300-1-2 12. nov. 2012 rev.001 dual synchronous buck converter bd93291efj description the bd93291efj is a dual synchronous buck converter. it integrates wide input voltage range (8.0v to 26v) synchronous buck converter and low input voltage (vout1 : 5.0v) synchronous buck converter. the ic also incorporates a new technology called h 3 reg tm , a rohm proprietary control method which facilitates ultra-high transient response against changes in load. sllm (simple light load mode) technology is also integrated to improve efficiency when powering lighter loads. for protection and ease of use, the ic also incorporates soft start. space-saving and high efficient switching regulator can be achieved due to built-in n-mosfet power transistor in htsop-j8 package. applications ? distributed power system ? pre-regulator for linear regulator typical application circuit features ? dual synchronous buck converter in small package. ? standby mode ( istandby = 0ua ) ? high voltage synchronous buck converter(vout1) - wide input range(8.0v to 26v) *absolute voltage 30v - h 3 reg tm dc/dc converter controller included - output current 1.7a *1 - fet on resistance high-side 0.175 /low-side 0.175 - internal soft-start function - switching frequency 300 to 600khz (*according to input/output conditions) - fixed output voltage (5.0v 1.5%; normal mode) ? low voltage synchronous buck converter(vout2) - input voltage range 5.0v(vout1) - h 3 reg tm dc/dc converter controller included - output current 0.5a *1 - fet on resistance high-side 0.25 /low-side 0.25 - internal soft-start function - switching frequency 1.5m to 2.5mhz (*according to input/output conditions) - feedback voltage (0.8v 1.5%; normal mode) ? protection circuits under voltage lockout protection thermal shutdown over current protection ? htsop-j8 package with exposed thermal pad. *1 vout1 maximum output curr ent capability is 2.5a, and vout2 maximum output current ca pability is 1.5a with the optimal pcb power consumption design. structure ? silicon monolithic integrated circuit package ? htsop-j8 6.00mm x 4.90mm x 1.00mm pin configuration (top view) swl gnd fbl vout bst vin en sw 1 2 3 45 6 7 8 bd93291efj c_co1 c_vc1 l1 thermal pad (to be shorted to gnd) c_bs vout1 r_up r_dw vout2 c_co2 l2 c_up c_co3
datasheet datasheet 2/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj block diagram vref vref vref tsd uvlo tsd uvlo tsd uvlo1 vreg lvs lvs lvs lvs lvs lvs drv drv logic vref current sense + soft start en tsd uvlo1 0.8v ocp fb 14v vout1 vin current sense uvlo2 0.8v soft start en tsd uvlo2 en vout vout2 fbl gnd ocp swl vout2(3.3v) vout1(5v, fix) sw vin bst vout h3reg controller block tm + drv drv logic h3reg controller block tm pin assignment and pin function no. symbol description 1 sw connect the inductor switching node of high voltage buck converter. this pin is connected to the source node of high side fet and the drain node of low side fet. 2 bst connect 0.1uf boot strap capacitor between bst pin and sw pin. this capacitor is for generating the driv ing voltage of high-side n-channel mosfet. 3 en this is enable pin of bd93291efj. high input (2.3v typ.) is output active. low input (1.8v typ.) is ic shutdown. the internal impedance of en pin is high, therefore add capacitor between en and gnd pin to reduce noise influence when this pin is connected to high-impedance node. 4 vin power supply pin of high voltage buck converter. this pin is connected to power fet supply and internal control blocks of high voltage buck converter. connect to 10uf(recommended value) ce ramic capacitor for bias capacitor. 5 gnd this pin is low-side n-channel mosfet power ground of high voltage buck converter, low-side n-channel mosfet power ground of low voltage bu ck converter and analog ground of other blocks. 6 fbl this pin is output voltage feed-back pin of low volt age buck converter. refer to ---page regarding the setting of output voltage. 7 swl connect the inductor switching node of low voltage buck converter. this pin is connected to the drain node of high side pch-fet and the drain node of low side fet. 8 vout this pin is power supply pin of low voltage buck c onverter and output voltage f eed-back pin of high voltage buck converter. this pin is connected to power fet supply and internal control blocks of low voltage buck converter. connect to 10uf(recommended value) ceramic capacitor for bias capacitor.
datasheet datasheet 3/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj absolute maximum ratings (ta = 25c) parameter symbol rating unit supply voltage 1 vin 30 v switch voltage 1 v sw 30 v supply voltage 2 vout 7.0 v switch voltage 2 v swl 7.0 v power dissipation for htsop-j8 pd 3760 *1 mw package thermal resistance ja *2 ja 29.27 /w package thermal resistance jc *2 jc 3.75 /w operating temperature range topr -40 to +85 storage temperature range tstg -55 to +150 junction temperature tjmax 150 bst voltage v bst v sw +7 v en voltage v en 30 v *1 derating in done 30.08 mw/ for operating above ta R 25 (mount on 4-layer 70.0mm 70.0mm 1.6mm board) *2 mount on 4-layer 50mm x 30mm x 1.6mm application board operation range(ta= -40 to 85 ) parameter symbol min typ max unit supply voltage 1 v in 8.0 14 26 v supply voltage 2 v out - 5.0 - v sw voltage 1 v sw -0.5 - 26 v sw voltage 2 v swl -0.5 - 5.5 v output voltage range 1 (fixed) v out1 - 5.0 - v output voltage range 2 v out2 0.8 3.3 4.0 v
datasheet datasheet 4/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj electrical characteristics (unless otherwise sp ecified vin=14v, vout1=5v, vout2=3.3v ta=25 ) parameter symbol limits unit conditions min typ max high voltage synchronous buck converter output voltage v out1 4.925 5.0 5.075 v 1.5%,normal mode hi-side fet on-resistance r onh1 - 0.175 - ? i sw = -0.8a lo-side fet on-resistance r onl1 - 0.175 - ? i sw = 0.8a hi/lo-side fet leak current i leak1 - 0 10 a v in = 26v, v sw = 0v / 26v switch current limit i limit1 3.0 - - a soft-start time v ss1 2.5 5.0 7.5 ms on time t on1 635 794 953 ns fsw1=450khz(typ) iout=0.3a minimum off time t off1 - 200 - ns low voltage synchronous buck converter feed-back voltage v fbl 0.788 0.8 0.812 v 1.5%,normal mode fbl input bias current i fbl -1.0 0 1.0 a hi-side fet on-resistance r onh2 - 0.25 - ? i swl = -0.8a lo-side fet on-resistance r onl2 - 0.25 - ? i swl = 0.8a hi/lo-side fet leak current i leak2 - 0 10 a v out1 = 5.5v, v swl = 0v / 5.5v switch current limit i limit2 2.0 - - a soft-start time v ss1 1.25 2.5 3.75 ms on time t on2 264 330 396 ns fsw2=2mhz(typ) iout=0.2a minimum off time t off3 - 50 - ns general enable sink current i en 33 56 73 a v en = 14v enable threshold voltage 1 v en_r 2.2 2.3 2.4 v rising enable threshold voltage 2 v en_f 1.7 1.8 1.9 v falling vin under voltage lockout threshold v uvlo1 7.1 7.5 7.9 v v in rising vin under voltage lockout hysteresis v hys1 - 1.0 - v vout under voltage lockout threshold v uvlo2 2.3 2.5 2.7 v v out rising vout under voltage lockout hysteresis v hys2 - 0.2 - v circuit current vin i cc_vin - 0.6 1.5 ma v out = 5.5v, v en = 14v circuit current vout i cc_vout - 0.6 1.5 ma v fbl = 1.0v, v en = 14v standby current i qui - 0 5 a v en = 0v * this product is not designed for protection against radioactive rays
datasheet datasheet 5/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj typical performance curves (unless otherwise noted ta=25 , vin=14v, vout1=5v, vout2=3.3v) figure 4. vout1 efficiency ( vin=14v , l=22 ? h ) figure 5. vout2 efficiency ( vout1=5v , vout2=3.3v , l=2.2 ? h ) 1 ? sec/div 1 ? sec/div 50 55 60 65 70 75 80 85 90 95 100 10 100 1000 10000 efficiency [%] iout1 [ma] 50 55 60 65 70 75 80 85 90 95 100 10 100 1000 10000 efficiency [%] iout2 [ma] figure 6. vout1 ripple voltage ( vin=14v , l1=22 ? h , cout1=22 ? f , iout=1a ) figure 7. vout2 ripple voltage (vout1=5v, vout2=3.3v, l2=2.2 ? h, cout2=22 ? f, iout=0.3a) vout1(ac) 50mv/div sw 5v/div isw 1a/div vout2(ac) 10mv/div swl 2v/div iswl 1a/div
datasheet datasheet 6/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj typical performance curves (unless otherwise noted ta=25 , vin=14v, vout1=5v, vout2=3.3v) (continued) 4.80 4.90 5.00 5.10 5.20 8 10 12 14 16 18 20 22 24 26 vout1 [v] vin[v] 4.80 4.90 5.00 5.10 5.20 -40 -20 0 20 40 60 80 vout1 [v] temperature [] figure 8. vout1 load regulation ( vin=14v , l1=22 p h ) figure 9. vout1 line regulation ( vin=14v , l1=22 p h , iout1=10ma / 1a ) figure 10. vout1 - temperature ( vin=14v , l1=22 p h , iout1=10ma/1a ) figure 11. sw_frequency - vin ( vin=14v , l1=22 p h , iout1=1a ) iout1=10ma iout1=1a 200 300 400 500 600 700 800 5 1015202530 frequency [khz] vin [v] 4.80 4.90 5.00 5.10 5.20 0 500 1000 1500 2000 2500 vout1 [v] iout1 [ma] iout1=10ma iout1=1a
datasheet datasheet 7/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj typical performance curves (unless otherwise noted ta=25 , vin=14v, vout1=5v, vout2=3.3v) (continued) 1 4msec/div 4msec/div figure 12. start up wave form (vin=14v, vout1=5v, vout2=3.3v, l1=22 ? h, l2=2.2 ? h, cout1=22 ? f, cout2=2.2 ? f, iout1=2a, iout2=1a) figure 13. off wave form (vin=14v, vout1=5v, vout2=3.3v, l1=22 ? h, l2=2.2 ? h, cout1=22 ? f, cout2=2.2 ? f, iout1=2a, iout2=1a) en 2v/div i in 1a/div vout1 2v/div vout2 2v/div figure 14. vout1 transient response (vin=14v, vout1=5v, l=22 ? h, cout=22 ? f) iout=0->2a (sr=0.2a/ ? sec) figure 15. vout1 transient response (vin=14v, vout1=5v, l=22 ? h, cout=22 ? f) iout=2->0a (sr=0.2a/ ? sec) vout1 (ac) 200mv/div iout1 2a/div 10 ? sec/div 10? sec/div sw 20v/div iout1 0a->2a/10us iout1 2a->0a/10us vout1 (ac) 200mv/div iout1 2a/div sw 20v/div en 2v/div i in 1a/div vout1 2v/div vout2 2v/div
datasheet datasheet 8/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj typical performance curves (unless otherwise noted ta=25 , vin=14v, vout1=5v, vout2=3.3v) (continued) 2 ? sec/div sw 20v/div iout1 2a/div 2 ? sec/div vout1 2v/div iout2 2a/div swl 2v/div vout2 200mv/div figure 16. vout2 transient response (vout1=5v, vout2=3.3v, l2=2.2 ? h, cout2=22 ? f), iout2=0->200ma ( sr=20ma/ ? sec ) figure 17. vout2 transient response (vout1=5v, vout2=3.3v, l2=2.2 ? h, cout2=22 ? f), iout2=200ma->0ma (sr=20ma/ ? sec) figure 18. vout1 ocp function (vin=14v, vout1=5v, vout2=3.3v, l1=22 ? h, cout1=22 ? f) ( vout1 is shorted to gnd ) figure 19. vout2 ocp function (vin=14v, vout1=5v, vout2=3.3v, l2=2.2 ? h, cout2=22 ? f) ( vout2 is shorted to gnd ) 10? sec/div iout2 200ma->0a/10us vout2 (ac) 20mv/div swl 2v/div iout2 200ma/div 10 ? sec/div iout2 0a->200ma/10us vout2 (ac) 20mv/div swl 2v/div iout2 200ma/div
datasheet datasheet 9/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj typical performance curves (unless otherwise noted ta=25 , vin=14v, vout1=5v, vout2=3.3v) (continued) figure 20. vout2 load regulation ( vout1=5v , l=2.2 ? h ) figure 21. vout2 - temperature ( vout1=5v , l=2.2 ? h , iout=1.5a ) 3.00 3.10 3.20 3.30 3.40 3.50 0 500 1000 1500 vout2 [v] iout [m a] 3.00 3.10 3.20 3.30 3.40 3.50 -40 -20 0 20 40 60 80 vout2 [v] ??????? ? ?!??>?b]?
datasheet datasheet 10/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj explanation of operation the bd93291efj is a dual synchronous buck conv erter incorporating rohm?s proprietary h 3 reg tm controlla system. when vout1 and vout2 drop due to a rapid load change, the system quickly restores vout1 and vout2 by increasing the frequency. 1. h 3 reg tm system 1-1. normal operation when fb falls below the threshold voltage (r ef), a drop is detected, activating the h 3 reg tm controlla system. f 1 v v ton in out ? ? [sec] (1) hg (gate of high side mosfet ) output is determined by the formula (1). lg (gate of low side mosfet) output operates until fb voltage falls below ref voltage after hg becomes of f. off time is restricted by min off time ( vout1 : 200nsec (typ.), vout2 : 50nsec (typ.) ). hence, bd93291efj runs with a constant on-time by using t he input and output voltage to set the internal on-time timer. 1-2. vout drops due to a rapid load change when fb (vout) drops due to a rapid load change and the volt age remains below ref, the system quickly restores vout by shortening off time of hg (increasing the frequency) , improving transient response as shown figure 22 (b). fb ref hg io lg fb ref hg lg fi g ure 22. h 3 reg s y stem ( a ) normal operation ( b ) rapid load chan g e
datasheet datasheet 11/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj timing chart 1. soft start function soft start is utilized when the en pin is set high. current control takes effect at startup, enabling a moderate ?ramping start ? on the output voltage. soft start time of vout 1 is 5.0msec (typ) and vout2 is 2.5ms (typ). protection operation 1. ocp operation normally, when fb voltage falls below ref voltage, hg become s high. however, if the peak current through the inductor (i l ) exceeds ocp current value (i ocp ) during hg=on, hg become off immediately and i l is restricted by i ocp . as the result, the output voltage can decrease as t he frequency and duty are changed. when ocp is released in the state that t he output has decreased by ocp operation, the output voltage might rise up due to high-speed load response. fi g ure 23. soft start timin g chart fi g ure 24. ocp timin g chart en vout1 5.0ms (typ) vout2 5v(fixed) 3.3v 2.5ms (typ) 2.5v (typ)
datasheet datasheet 12/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj 2. tsd operation (self recovery) tsd is self-activating. if the junction temperature exceeds tj = 175 , and hg, lg, and ss become low. the ic becomes standby when tsd operating. when tj falls below 150 , it returns to standard operation . 3. uvlo operation uvlo operates when vin voltage falls below 6.5v, and hg and lg become low. the ic becomes standby when uvlo operating. uvlo is released when vin goes up to 7.5v, and starts standard operation selection of components externally connected 1. output lc filter selection (buck converter) 1-1. inductor (l) selection the output lc filter is required to supply constant current to the output load. a larger value inductance at this filter result s in less inductor ripple current ( i l ) and less output ripple voltage. however, t he larger value inductors tend to have less fast load transient-response, a larger physical size, a lowe r saturation current and higher series resistance. a smaller value inductance has almost opposite characteristics above. the value of i l is shown as formula (2). the larger value of the inductance or the faster switching frequency make the lower ripple voltage. in out out in l vfl v vv ?i uu u [a] (2) the proper output ripple current setting is about 30% of maximum output current. outmax l i3.0i u ' [a] (3) in l out out in vfi v vv l uu' u [h] (4) ( i l : output ripple current f : switching frequency) a larger current than the inductor?s rated current will cause ma gnetic saturation in the inductor, and decrease efficiency. when selecting an inductor, be sure to allow enough margins to assure that peak current d oes not exceed the inductor?s rated current value. to minimize loss of inductor and improve efficiency, choose a inductor with a low resistance (dcr, acr). v in i l l c out vout hg sw lg i l fi g ure 25. inductor ripple current
datasheet datasheet 13/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj 1-2. output capacitor (c out ) selection output capacitor (c out ) has a considerable influence on output voltage regulation due to a rapid load change and smoothing output ripple voltage. determine the capacitor by considering the value of capacity, the equivalent series resistance, and equivalent series inductance. also, make su re the capacitor?s voltage rating is high enough for the set output voltage (including ripple). output ripple voltage is determined as in formula (5) below. vout= i l /(8 c out f)+esr i l +esl i l / ton [v] (5) ( i l output ripple current esr: equivalent series resistance esl: equivalent series inductance) also, give consideration to the conditions in formula (6) below for output capacitance, bearing in mind that output rise time must be established within the fixed soft start time. as out put capacitance, bypass capacitor will be also connected to output load side (c ext , figure 26). please set the over current detection value with regards to these capacitance. ? ? out out ocp out v iiss c ?? ? [f] (6) (ss : soft start time, i ocp : ocp current limit, i out : output current) note: an improper output capacitor may cause startup malfunctions. 2. input capacitor (cin) selection figure 27. input capacitor in order to prevent transient spikes in vo ltage, the input capacitor should have a lo w enough esr resistance to fully support a large ripple current. the formula for ripple current i rms is given in equation (7) as below. where v in =2 vout, i rms = i out 2 v in l c out vout c in hg sw lg a lo w esr capacitor is recommended to reduce esr loss and improve efficiency. capacitor cout between vout and gnd must be placed near the vout pin. ( 7 ) fi g ure 26. output capacito r [ a ] vin l c out vout esr esl hg sw lg load c ext in out in out out rms v )v(vv ii ?? ??
datasheet datasheet 14/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj 3. vout2 output voltage setting the ic controls output voltage as ref Pv fbl . however, the actual output voltage will also reflect the average ripple voltage value. the vout2 output voltage is set with a resistor divider from the output node to the fbl pin. the formula for output voltage is given in (8) below: vout2 = ref +? vout [v] (8) ref = v fbl (typ 0.8v) + 0.02 ? (on duty 0.05) [v] (9) on duty = (10) c_up is needed to feedback output voltage ri pple to fbl pin, the value is calculated to c_up = [f] (11) please refer to eq. (5) regarding ? vout. 4. relationship between output voltage and ontime bd93291efj is a dual synchronous buck converter contro lling constant ontime. the ontime (ton) depends on the output voltage settings, as described by the formula (12). frequency 1 v v ton in out u P [sec] (12) r_up+rd_w r_dw h 3 reg tm controlla s rq driver circuit output voltage vout2 v fbl r_up r_dw ref vout1 vout2 vout1 fi g ure 28. output volta g e vout2 settin g c_up 11e-6 (+/-30%) r_up
datasheet datasheet 15/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj pcb layout guide two high pulsing current flowing loops exist in the buck regulator system. the first loop, when fet is on, starts from the input capacito rs, to the vin terminal, to the sw terminal, to the inductor, to the output capacitors, and then returns to the input capacitor through gnd. the second loop, when fet is off, starts from the low fet, to the inductor, to the output capacitor, and then returns to the low fet through gnd. to reduce the noise and improve the efficiency, please minimize these two loop area. especially input capacitor and output capacitor should be connected to gnd plain. pcb layout may affect the thermal perfo rmance, noise and efficiency greatly. so please take extra care when designing pcb layout patterns. ? the thermal pad on the back side of ic has the great thermal co nduction to the chip. so using the gnd plain as broad and wide as possible can help thermal dissipation. and a lot of the rmal via for helping the spread of heat to the different layer i s also effective. ? the input capacitors (c_vc1 and c_co3) should be connec ted as close as possible to the vin or vout terminal. especially, c_co3 between vout and gnd must be placed near the vout pin, and keep the distance "b" less than 2mm. ? when there is unused area on pcb, please arrange the copper fo il plain of dc nodes, such as gnd, vin and vout for helping heat dissipation of ic or circumference parts. ? to avoid the noise influence from ac combination with the other line, keep the switching line such as sw and swl not extend as much as possible, and trace shortly and thickly to coil l1 and l2. ? keep sensitive signal traces such as trace connected fbl away from sw and swl pins. ? the inductors and the output capacitors should be plac ed close to sw or swl pins as much as possible. ? keep vout pattern width "a" more than 3mm to stable the 5v output. c in fet c out l vout vin fi g ure 29. current loop buck re g ulator s y stem fi g ure 30. example of pcb la y out pattern gnd
datasheet datasheet 16/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj list of evaluation board components ? recommended components list (vin=14v, vout1=5v, vout2=3.3v) symbol part value manufacture series c_vc1 ceramic capacitor 10uf murata grm32df51h106za01l c_bst ceramic capacitor 0.1uf murata grm188f11h104za01 l1 coil 22uh tdk slf10165 220m 2r4 l2 coil 2.2uh tdk vlf 4012s 2r2m 1r3 c_co1 ceramic capacitor 22uf murata grm21bb31a226me51l c_co2 ceramic capacitor 22uf murata grm21bb31a226me51l c_co3 ceramic capacitor 10uf murata grm21bb31a106me18 c_up ceramic capacitor 680pf murata grm1882c1h681ja01 r_up resistance 16k ? rohm mcr03 1608size tolerance f r_dw resistance 5.1k ? rohm mcr03 1608size tolerance f the above components list is an example. pleas e check actual circuit characteristics on the application carefully before use. fi g ure 31. t y pical application circuit c_co1 c_vc1 l1 thermal pad (to be shorted to gnd) c_bs vout1 r_up r_dw vout2 c_co2 l2 c_up c_co3
datasheet datasheet 17/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj en vout fbl vout swl vout vout swl vin vin sw i/o equivalence circuit sw bst en fbl swl vout reg sw vin bst
datasheet datasheet 18/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj operational notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open m ode) when such damage is suffered. if operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. (2) gnd voltage the potential of the gnd pin must be the minimum potential in the syst em in all operating conditions. (3) thermal design use a thermal design that allows for a sufficient margin fo r power dissipation (pd) under actual operating conditions (4) inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power supply and gnd pins caused by poor soldering or foreign objects may result in damage to the ic. (5) operation in strong electromagnetic fields using this product in strong electromagnetic fields may caus e ic malfunction. caution should be exercised in applications where strong electromagnetic fields may be present. (6) aso (area of safe operation) when using the ic, ensure that operating conditions do not exceed absolute ma ximum ratings or aso of the output transistors. (7) testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each pr ocess or step. the ic?s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the ev aluation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. (8) electrical characteristics the electrical characteristics indicated in this datasheet ma y change upon the conditions of temperature, supply voltage, and external components. please validate/verify your design at the worst case conditions. (9) not of a radiation-resistant design. (10) back electromotive force if a large inductive load is connected at the output pin that might c ause introducing back electromotive force at the start up and at the output disable, plea se insert protection diodes. (11) regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elemen ts in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): ? ?when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode ?when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, a nd the operation of these parasiti c diodes can result in mutual interference among circuits, operational faults, or physical dam age. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fi g ure 32. back electromotive force output pin
datasheet datasheet 19/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj (12) ground wiring pattern when using both small-signal and large-current gnd traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on gnd voltage. (13) operating condition the electrical characteristics indicated in this datasheet are not guaranteed for the whole operational and temperature ranges, however these characteristics do not significantly fluctuate within the operat ional and temperature ranges. (14) thermal shutdown (tsd) circuit the ic incorporates a built-in thermal shutdown circuit, which is designed to turn the ic off completely in the event of thermal overload. it is not designed to protect the ic from damage or guarantee its operation. ics should not be used after this function has activated, or in applications where the operation of this circ uit is assumed. if the thermal shutdown is activated while the load current exists , the output may possibly be latched off at the release of the thermal shutdown. (15) heat sink (fin) the heat sink (fin) is connected to the substrate. please connect it to gnd. status of this document the english version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority tsd on temp.[ ] (typ.) hysteresis temp[ ] (typ.) 175 25 fi g ure 33. example of ic structure resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element
datasheet datasheet 20/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj thermal derating curves ordering information b d 9 3 2 9 1 e f j - e 2 part numbe r package efj: htsop-j8 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram figure 34. thermal derating curve (htsop-j8) 150 0 50 75 100 125 2000 4000 1000 3000 25 power dissipation: pd [mw] ambient temperature: ta [c] (1)820mw (2)1100mw (3)2110mw (4)3760mw 0 htsop-j8 package on 70 ? 70 ? 1.6 mm glass epoxy pcb (1) 1-layer board (backside copper foil area 0 mm ? 0 mm) (2) 2-layer board (backside copper foil area 15 mm ? 15 mm) (3) 2-layer board (backside copper foil area 70 mm ? 70 mm) (4) 4-layer board (backside copper foil area 70 mm ? 70 mm) ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin htsop-j8(top view) d93291 part number marking lot number 1pin mark
datasheet datasheet 21/21 tsz02201-0323aaj00300-1-2 ? 2012 rohm co., ltd. all rights reserved. 12. nov. 2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd93291efj revision history date revision changes 12.nov.2012 001 new release
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd93291efj package htsop-j8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd93291efj - web page distribution inventory

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